Eric Bogatin received his B.S. in Physics from MIT in 1976 and his M.S. and Ph.D. in Physics from the University of Arizona in Tucson in 1980. For more than 30 years he has been active in the fields of signal integrity and interconnect design. He worked in senior engineering and management roles at AT&T Bell Labs, Raychem Corp, Sun Microsystems, Interconnect Devices Inc., and Teledyne LeCroy. In 2011, his company, Bogatin Enterprises, was acquired by Teledyne LeCroy.

Eric currently is a Signal Integrity Evangelist with Teledyne LeCroy, where he creates and presents educational materials related to new applications for high-performance scopes. Eric turns complexity into practical design and measurement principles, leveraging analysis techniques and measurement tools. Since 2012, he has been an adjunct professor at the University of Colorado in Boulder, teaching graduate courses in signal integrity, interconnect design, and PCB design.

He has written regular monthly columns for PCD&F Magazine, Semiconductor International, Electronic Packaging and Production, Altera Corporation, Mentor Graphics Corporation, EDN, and EE Times. He is currently the editor of the Signal Integrity Journal ([...] )

Eric is a prolific author with more than 300 publications, many posted on his website, [...] for download. He regularly presents at DesignCon, the IEEE EMC Symposium, EDI con, and at IPC’s Designer Council events. He is the coauthor of the popular Prentice Hall book, Principles of Power Integrity for PDN Design - Simplified, along with Larry Smith.

He was the recipient of the 2016 Engineer of the Year Award from DesignCon.
He can be reached at [...].

Preface to the Third Edition xix
Preface to the Second Edition xxi
Preface to the First Edition xxiii
Chapter 1 Signal Integrity Is in Your Future 1
1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility? 3
1.2 Signal-Integrity Effects on One Net 7
1.3 Cross Talk 11
1.4 Rail-Collapse Noise 14
1.5 Electromagnetic Interference (EMI) 17
1.6 Two Important Signal-Integrity Generalizations 19
1.7 Trends in Electronic Products 20
1.8 The Need for a New Design Methodology 26
1.9 A New Product Design Methodology 27
1.10 Simulations 29
1.11 Modeling and Models 34
1.12 Creating Circuit Models from Calculation 36
1.13 Three Types of Measurements 42
1.14 The Role of Measurements 45
1.15 The Bottom Line 48
Review Questions 50
Chapter 2 Time and Frequency Domains 51
2.1 The Time Domain 52
2.2 Sine Waves in the Frequency Domain 54
2.3 Shorter Time to a Solution in the Frequency Domain 56
2.4 Sine-Wave Features 58
2.5 The Fourier Transform 60
2.6 The Spectrum of a Repetitive Signal 62
2.7 The Spectrum of an Ideal Square Wave 64
2.8 From the Frequency Domain to the Time Domain 66
2.9 Effect of Bandwidth on Rise Time 68
2.10 Bandwidth and Rise Time 72
2.11 What Does Significant Mean? 73
2.12 Bandwidth of Real Signals 77
2.13 Bandwidth and Clock Frequency 78
2.14 Bandwidth of a Measurement 80
2.15 Bandwidth of a Model 83
2.16 Bandwidth of an Interconnect 85
2.17 The Bottom Line 89
Review Questions 90
Chapter 3 Impedance and Electrical Models 93
3.1 Describing Signal-Integrity Solutions in Terms of Impedance 94
3.2 What Is Impedance? 97
3.3 Real Versus Ideal Circuit Elements 99
3.4 Impedance of an Ideal Resistor in the Time Domain 102
3.5 Impedance of an Ideal Capacitor in the Time Domain 103
3.6 Impedance of an Ideal Inductor in the Time Domain 107
3.7 Impedance in the Frequency Domain 109
3.8 Equivalent Electrical Circuit Models 115
3.9 Circuit Theory and SPICE 117
3.10 Introduction to Measurement-Based Modeling 121
3.11 The Bottom Line 126
Review Questions 128
Chapter 4 The Physical Basis of Resistance 131
4.1 Translating Physical Design into Electrical Performance 132
4.2 The Only Good Approximation for the Resistance of Interconnects 133