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As a comprehensive guide to the emerging field of embedded artificial intelligence, the book offers rich and in-depth content, a clear and logical structure, and a balanced approach to both theoretical analysis and practical applications. It provides significant reference value and can serve as an introductory and reference guide for researchers, scholars, students, engineers, and professionals interested in studying and implementing embedded artificial intelligence.
As a comprehensive guide to the emerging field of embedded artificial intelligence, the book offers rich and in-depth content, a clear and logical structure, and a balanced approach to both theoretical analysis and practical applications. It provides significant reference value and can serve as an introductory and reference guide for researchers, scholars, students, engineers, and professionals interested in studying and implementing embedded artificial intelligence.
Bin Li held chief technical positions in several Fortune 500 companies, and he earned a Master's degree in pattern recognition and artificial intelligence from Beijing Institute of Technology. His research areas include artificial intelligence, distributed computing, and data communication. He is the first inventor of over 20 Chinese and international invention patents.
PART I. PRINCIPLES.- Chapter 1. Embedded Artificial Intelligence.- Chapter 2. Principle of Embedded AI Chips.- Chapter 3. Lightweight Neural Networks.- Chapter 4. Compression of Deep Neural Network.- Chapter 5. Framework for Embedded Neural Network Applications.- Chapter 6. Lifelong Deep Learning.- PART II. PLATFORMS.- Chapter 7. Embedded AI Accelerator Chips.- Chapter 8. Software Framework for Embedded Neural Networks.- PART III. PRACTICES.- Chapter 9. Embedded AI Development Process.- Chapter 10. Optimizing Embedded Neural Network Models.- Chapter 11. Examples of Embedded Neural Network Application.- Chapter 12. Conclusion: Intelligence in Everything.
Erscheinungsjahr: | 2024 |
---|---|
Genre: | Importe, Informatik |
Rubrik: | Naturwissenschaften & Technik |
Medium: | Taschenbuch |
Inhalt: |
xi
260 S. 113 s/w Illustr. 33 farbige Illustr. 260 p. 146 illus. 33 illus. in color. |
ISBN-13: | 9789819750375 |
ISBN-10: | 9819750377 |
Sprache: | Englisch |
Einband: | Kartoniert / Broschiert |
Autor: | Li, Bin |
Hersteller: |
Springer Singapore
Springer Nature Singapore |
Verantwortliche Person für die EU: | Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com |
Maße: | 235 x 155 x 15 mm |
Von/Mit: | Bin Li |
Erscheinungsdatum: | 07.09.2024 |
Gewicht: | 0,417 kg |
Bin Li held chief technical positions in several Fortune 500 companies, and he earned a Master's degree in pattern recognition and artificial intelligence from Beijing Institute of Technology. His research areas include artificial intelligence, distributed computing, and data communication. He is the first inventor of over 20 Chinese and international invention patents.
PART I. PRINCIPLES.- Chapter 1. Embedded Artificial Intelligence.- Chapter 2. Principle of Embedded AI Chips.- Chapter 3. Lightweight Neural Networks.- Chapter 4. Compression of Deep Neural Network.- Chapter 5. Framework for Embedded Neural Network Applications.- Chapter 6. Lifelong Deep Learning.- PART II. PLATFORMS.- Chapter 7. Embedded AI Accelerator Chips.- Chapter 8. Software Framework for Embedded Neural Networks.- PART III. PRACTICES.- Chapter 9. Embedded AI Development Process.- Chapter 10. Optimizing Embedded Neural Network Models.- Chapter 11. Examples of Embedded Neural Network Application.- Chapter 12. Conclusion: Intelligence in Everything.
Erscheinungsjahr: | 2024 |
---|---|
Genre: | Importe, Informatik |
Rubrik: | Naturwissenschaften & Technik |
Medium: | Taschenbuch |
Inhalt: |
xi
260 S. 113 s/w Illustr. 33 farbige Illustr. 260 p. 146 illus. 33 illus. in color. |
ISBN-13: | 9789819750375 |
ISBN-10: | 9819750377 |
Sprache: | Englisch |
Einband: | Kartoniert / Broschiert |
Autor: | Li, Bin |
Hersteller: |
Springer Singapore
Springer Nature Singapore |
Verantwortliche Person für die EU: | Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com |
Maße: | 235 x 155 x 15 mm |
Von/Mit: | Bin Li |
Erscheinungsdatum: | 07.09.2024 |
Gewicht: | 0,417 kg |