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Atomic Layer Processing
Semiconductor Dry Etching Technology
Taschenbuch von Thorsten Lill
Sprache: Englisch

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Beschreibung
This practical guide, written by an author actively involved in corporate R&D, provides in-depth information on etching technologies that are used in the semiconductor industry, helping engineers to select the right technologies for their task and to design etching processes.
This practical guide, written by an author actively involved in corporate R&D, provides in-depth information on etching technologies that are used in the semiconductor industry, helping engineers to select the right technologies for their task and to design etching processes.
Inhaltsverzeichnis
1. INTRODUCTION

2. FUNDAMENTALS
2.1. Important performance metrics of etching processes
2.2. Physisorption and Chemisorption
2.3. Desorption
2.4. Surface Reactions
2.5. Sputtering
2.6. Implantation
2.7. Diffusion
2.8. Transport phenomena in 3D features
2.8.1. Neutral transport
2.8.2. Ion transport
2.8.3. Transport of reaction products
2.9. Classification of etching technologies

3. THERMAL ETCHING
3.1. Mechanism and performance metrics of Thermal Etching
3.2. Applications examples

4. THERMAL ISOTROPIC ALE
4.1. Mechanism of Thermal Isotropic ALE
4.1.1. Chelation / Condensation ALE
4.1.2. Ligand Exchange ALE
4.1.3. Conversion ALE
4.1.4. Oxidation / Fluorination ALE
4.2. Performance metrics of Thermal Isotropic ALE
4.3. Plasma-assisted Isotropic ALE
4.4. Applications examples
4.4.1. Area-selective deposition
4.4.2. Formation of lateral devices

5. RADICAL ETCHING
5.1. Mechanism of Radical Etching
5.2. Performance metrics
5.3. Applications examples

6. DIRECTIONAL ALE
6.1. Mechanism of Directional ALE
6.1.1. ALE with directional modification step
6.1.2. ALE with directional removal step and modification by chemisorption and diffusion
6.1.3. ALE with directional removal step and modification by reactive layer deposition
6.2. Performance metrics
6.3. Applications examples

7. REACTIVE ION ETCHING
7.1. Reactive Ion Etching Mechanisms
7.1.1. Simultaneous species fluxes
7.1.2. Chemical sputtering
7.1.3. Mixed layer formation
7.1.4. Role of etching products
7.2. Performance metrics
7.3. Application examples
7.3.1. Patterning
7.3.2. Logic Devices
7.3.3. DRAM and 3D NAND memory
7.3.4. Emerging memories

8. ION BEAM ETCHING
8.1. Mechanism and performance metrics of Ion Beam Etching
8.2. Applications examples

9. ETCHING SPECIES GENERATION
9.1. Introduction of low temperature plasmas
9.2. Capacitively coupled plasmas
9.3. Inductively coupled plasmas
9.4. Ion energy distribution modulation
9.5. Plasma-pulsing
9.6. Grid sources

10. EMERGING ETCHING TECHNOLOGIES
10.1. Electron assisted chemical etching
10.2. Photon assisted chemical etching
Details
Erscheinungsjahr: 2021
Genre: Chemie, Mathematik, Medizin, Naturwissenschaften, Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
Inhalt: XIV
284 S.
150 s/w Illustr.
150 Illustr.
ISBN-13: 9783527346684
ISBN-10: 3527346686
Sprache: Englisch
Herstellernummer: 1134668 000
Autor: Lill, Thorsten
Auflage: 1. Auflage
Hersteller: Wiley-VCH
Verantwortliche Person für die EU: Wiley-VCH GmbH, Boschstrasse 12, D-69469 Weinheim, product_safety@wiley.com
Abbildungen: 150 SW-Abb.
Maße: 15 x 170 x 244 mm
Von/Mit: Thorsten Lill
Erscheinungsdatum: 21.04.2021
Gewicht: 0,584 kg
Artikel-ID: 118949241
Inhaltsverzeichnis
1. INTRODUCTION

2. FUNDAMENTALS
2.1. Important performance metrics of etching processes
2.2. Physisorption and Chemisorption
2.3. Desorption
2.4. Surface Reactions
2.5. Sputtering
2.6. Implantation
2.7. Diffusion
2.8. Transport phenomena in 3D features
2.8.1. Neutral transport
2.8.2. Ion transport
2.8.3. Transport of reaction products
2.9. Classification of etching technologies

3. THERMAL ETCHING
3.1. Mechanism and performance metrics of Thermal Etching
3.2. Applications examples

4. THERMAL ISOTROPIC ALE
4.1. Mechanism of Thermal Isotropic ALE
4.1.1. Chelation / Condensation ALE
4.1.2. Ligand Exchange ALE
4.1.3. Conversion ALE
4.1.4. Oxidation / Fluorination ALE
4.2. Performance metrics of Thermal Isotropic ALE
4.3. Plasma-assisted Isotropic ALE
4.4. Applications examples
4.4.1. Area-selective deposition
4.4.2. Formation of lateral devices

5. RADICAL ETCHING
5.1. Mechanism of Radical Etching
5.2. Performance metrics
5.3. Applications examples

6. DIRECTIONAL ALE
6.1. Mechanism of Directional ALE
6.1.1. ALE with directional modification step
6.1.2. ALE with directional removal step and modification by chemisorption and diffusion
6.1.3. ALE with directional removal step and modification by reactive layer deposition
6.2. Performance metrics
6.3. Applications examples

7. REACTIVE ION ETCHING
7.1. Reactive Ion Etching Mechanisms
7.1.1. Simultaneous species fluxes
7.1.2. Chemical sputtering
7.1.3. Mixed layer formation
7.1.4. Role of etching products
7.2. Performance metrics
7.3. Application examples
7.3.1. Patterning
7.3.2. Logic Devices
7.3.3. DRAM and 3D NAND memory
7.3.4. Emerging memories

8. ION BEAM ETCHING
8.1. Mechanism and performance metrics of Ion Beam Etching
8.2. Applications examples

9. ETCHING SPECIES GENERATION
9.1. Introduction of low temperature plasmas
9.2. Capacitively coupled plasmas
9.3. Inductively coupled plasmas
9.4. Ion energy distribution modulation
9.5. Plasma-pulsing
9.6. Grid sources

10. EMERGING ETCHING TECHNOLOGIES
10.1. Electron assisted chemical etching
10.2. Photon assisted chemical etching
Details
Erscheinungsjahr: 2021
Genre: Chemie, Mathematik, Medizin, Naturwissenschaften, Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
Inhalt: XIV
284 S.
150 s/w Illustr.
150 Illustr.
ISBN-13: 9783527346684
ISBN-10: 3527346686
Sprache: Englisch
Herstellernummer: 1134668 000
Autor: Lill, Thorsten
Auflage: 1. Auflage
Hersteller: Wiley-VCH
Verantwortliche Person für die EU: Wiley-VCH GmbH, Boschstrasse 12, D-69469 Weinheim, product_safety@wiley.com
Abbildungen: 150 SW-Abb.
Maße: 15 x 170 x 244 mm
Von/Mit: Thorsten Lill
Erscheinungsdatum: 21.04.2021
Gewicht: 0,584 kg
Artikel-ID: 118949241
Sicherheitshinweis